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Optically-Switched Microwave Filter with the use of Photovaractors in Self-Bias Mode
OPTICALLY-SWITCHED MICROWAVE FILTER WITH THE USE OF PHOTOVARACTORS IN SELF-BIAS MODE Zenon R. Szczepaniak*, Bogdan A. Galwas& and Sergei A. Malyshev# *& Institute of Microelectronics and Optoelectronics, Warsaw University of Technology Nowowiejska 15/19, 00-665 Warsaw, Poland Phone/Fax: (+48 22) 825 03 93 * zenon.szczepaniak@elka.pw.edu.pl , & B.Galwas@elka.pw.edu.pl # Institute of Electronics, N
Thick Metal Plate Insertion Make FR4 Multilayer Board a Simple Carrier for RF Power Circuits
Thick metal plate insertion make FR4 multilayer board a simple carrier for RF power circuits Carlo Buoli , Giovanni Biffi, Tommaso Turillo, Alessandro Zingirian Siemens Information and Communication Networks S.p.A., Strada Padana Superiore Km158 20060, Cassina de Pecchi - MILANO. e-mail: Carlo.Buoli@icn.siemens.it, Giovanni_Ivano.Biffi@icn.siemens.it, Tommaso.Turillo@icn.siemens.it, Alessandro.Zi
Line Capacitance and Impedance of Coplanar-Strip Waveguides on Substrates with Multiple Dielectric Layers
LINE CAPACITANCE AND IMPEDANCE OF COPLANAR-STRIP WAVEGUIDES ON SUBSTRATES WITH MULTIPLE DIELECTRIC LAYERS 1 S. Gevorgian 1,2 and H. Berg1 Department of Microelectronics, Chalmers University of Technology, Gothenburg, Sweden 2 Ericsson Microwave Systems, Moelndal, Sweden email: spartak@ep.chalmers.se ABSTRACT Closed form formulas for the basic parameters of Coplanar-Strip line on a finite thickne
Measurement and Modelling of MIC Components Using Conductive Lithographic Films
Measurement and Modelling of MIC Components Using Conductive Lithographic Films P. R. Shepherd *, & C. Taylor *, P. S. A. Evans l, & D. J. Harrison l *Dept. Electronic & Elec. Eng., University of Bath, Claverton Down, Bath, BA2 7AY, U.K. Email: P.R.Shepherd@bath.ac.uk l Dept. of Design, Brunel University, Englefield Green, Egham, TW20 0JZ, U.K. Email: Peter.Evans@brunel.ac.uk July 11, 2001 AB
Reliability and Performances of Finite Element CAD Tools for the Solution of Microwave Problems
RELIABILITY AND PERFORMANCES OF FINITE ELEMENT CAD TOOLS FOR THE SOLUTION OF MICROWAVE PROBLEMS P. Fernandes *, M. Raffetto * Istituto per la Matematica Applicata del Consiglio Nazionale delle Ricerche, Via De Marini 6, I-16149 Genoa, Italy, fernandes@ima.ge.cnr.it DIBE, University of Genoa, Via Opera Pia 11a, I16145, Genoa, Italy, raffetto@dibe.unige.it ABSTRACT The target of this paper is tw
Mode Transformer for Hard-Surface Waveguides
Mode transformer for hard-surface waveguides T. Uusitupa, A. Viitanen Electromagnetics Laboratory Department of Electrical and Communications Engineering Helsinki University of Technology, P.O. Box 3000, FIN-02015 HUT, Finland e-mail: tero.uusitupa@hut.fi, ari.viitanen@hut.fi Abstract Mode transformation effect inside a corrugated circular waveguide filled with gyrotropic material, e.g., magnetopl
The Choice of Cell Size and the use of Pre-Calculated Correction Factors in the Analysis of Planar Circuits using FDTD and TLM
THE CHOICE OF CELL SIZE AND THE USE OF PRE-CALCULATED CORRECTION FACTORS IN THE ANALYSIS OF PLANAR CIRCUITS USING FDTD AND TLM. Chris J Railton Centre for Communications Research, Faculty of Engineering University of Bristol, Bristol, England, BS8 1BU Phone: (0)117 9545175 Fax: (0)117 9545206 Email chris.railton@bristol.ac.uk ABSTRACT In this contribution it is shown that small changes to the ch
60GHz-Band Flip-Chip MMIC Modules for IEEE1394 Wireless Adapters
60GHZ-BAND FLIP-CHIP MMIC MODULES FOR IEEE1394 WIRELESS ADAPTERS K. Maruhashi, M. Ito, K. Ikuina, T. Hashiguchi, J. Matsuda, W. Domon, S. Iwanaga*, N. Takahashi**, T. Ishihara**, Y. Yoshida**, I. Izumi** and K. Ohata NEC Corporation, 2-9-1 Seiran, Otsu, Shiga 520-0833, JAPAN, e-mail:k-maruhashi@bl.jp.nec.com *NEC Kansai, Ltd., 2-9-1 Seiran, Otsu, Shiga 520-0833, JAPAN **NEC Engineering, Ltd., 1753
Influence of 0-Level Packaging on the Microwave Performance of RF-MEMS Devices
Influence of 0-level packaging on the microwave performance of RF-MEMS devices A. Jourdain, S. Brebels, W. De Raedt and H. A. C. Tilmans IMEC vzw, Kapeldreef 75, B-3001 Leuven, Belgium Tel: +32 16 288 220, Fax: +32 16 281 501, E-mail: jourdain@imec.be Abstract RF-MEMS devices (Radio Frequency-MicroElectroMechanical Systems) are made of moveable and fragile structures (membranes, beams, cantilevers
A New Mesh Reduction Technology for the Method of Moments Modelling of Planar RF and Microwave Interconnects
A NEW MESH REDUCTION TECHNOLOGY FOR THE METHOD OF MOMENTS MODELLING OF PLANAR RF AND MICROWAVE INTERCONNECTS Jeannick Sercu(*), Luc Knockaert(**), Daniel De Zutter(**) (*) Agilent Technologies EEsof EDA, Lammerstraat 20, 9000 Ghent, Belgium (**) Department of Information Technology, Ghent University, Belgium ABSTRACT This paper describes a new mesh reduction technology that significantly increas