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A Compact System for Systematic Noise Measurement of Schottky Diodes for THz Applications
1 A Compact System for Systematic Noise Measurement of Schottky Diodes for THz Applications ¨ S. Biber, O. Koca, K. Huber, G. Rehm, L.-P. Schmidt Lehrstuhl f¨ r Hochfrequenztechnik (LHFT), Universit¨ t Erlangen-N¨ rnberg u a u Cauerstr. 9, D-91058 Erlangen, Germany phone: +49 9131 8527223, facsimile: +49 9131 8527212, email: stephan@lhft.eei.uni-erlangen.de Abstract--As Schottky diodes still rema
Time domain method for the noise parameters measurement
Time domain method for the noise parameters measurement Fre de rique Giannini, Emmanuelle Bourdel, Daniel Pasquet ENSEA/EMO, 6, avenue du Ponceau, 95014 Cergy, France, giannini@ensea.fr The noise parameters are usually measured by a multi-impedance method. We propose a new method which requires a lighter equipment using a numerical process. It consists in using an inverse Fouriers transform in ord
Cold-FET ENR Characterisation Applied to the Measurement of On-Wafer Transistor Noise Parameters
Cold-FET ENR Characterisation Applied to the Measurement of On-Wafer Transistor Noise Parameters M.C. Maya, A. Lázaro, and L. Pradell, Member, IEEE Universitat Politècnica de Catalunya (UPC), Dept. TSC, Campus Nord UPC Mòdul D3, 08034, Barcelona Spain, fax: +34-93-4017232, email: mcmaya@tsc.upc.es; lazaro@tsc.upc.es; pradell@tsc.upc.es Abstract This paper presents a method to characterize th
On-Chip Microwave Filters on Standard Silicon Substrate Incorporating a Low-k BCB Dielectric Layer
On-Chip Microwave Filters on Standard Silicon Substrate Incorporating a Low-k BCB Dielectric Layer Lydia L. W. Leung, Kevin J. Chen, Xiao Huo and Philip C. H. Chan Department of Electrical and Electronic Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong. eelydia@ee.ust.hk, Tel.: +852-2358-7082, Fax: +852-2358-1485 Abstract - A low-loss, low -pass microstrip t
A New Type of Low Pass Filter With Defected Ground Structure
A New Type of Low Pass Filter With Defected Ground Structure Jong-Sik Lim, Chul-Soo Kim*, Young-Taek Lee, Dal Ahn**, and Sangwook Nam School of Electrical Engineering and Computer Science, Seoul National Univ., Seoul, Rep. Of Korea * Telecomm. Basic Research Lab., Electronics and Telecomm. Research Institute, Daejeon, Rep. Of Korea ** Division of Information Technology Engineering, SoonChunHyang U
Rectangular Waveguide Filters Using Photoimageable Thick-film Processing
Rectangular Waveguide Filters Using Photoimageable Thickfilm Processing M. S. Aftanasar, P. R. Young*, I. D. Robertson Microwave System and Research Group (MSRG), School of Electronics, Computing and Mathematics, University of Surrey, Guildford, Surrey, GU2 7XH, U.K. Tel: ++44 (0)1483 259869 Fax: ++44 (0)1483 876081 Email: eep6ma@eim.surrey.ac.uk *Department of Electronics, University of Kent at C
Nonlinear Signal Processing by means of Surface Magnetostatic Waves: Solitons in Metallized Structures
European Microwave Week 2002 - 32nd European Microwave Conference Conference Session: M2 - "New technologies and Materials for Microwave components I 1 Nonlinear Signal Processing by means of Surface Magnetostatic Waves: Solitons in Metallized Structures. T. Koike(1), R. Marcelli(2), Y. Filimonov(3), S.A. Nikitov(4), and G. Bartolucci(5) Dept. of Electronic Engineering, Tamagawa University, Mach
High Frequency Applications For Two-Dimensional Periodic Substrates
High Frequency Applications For Two-Dimensional Periodic Substrates William Chappell, Linda Katehi* The University of Michigan, Ann Arbor, MI, 48109-2122, USA * Purdue University, West Lafayette, IN, 47907, USA Abstract -- The use of advanced ceramic fabrication, specifically, the Indirect Solid Free Form method was utilized to develop high frequency periodic substrates. The electrically thick sub
Finite Substrate Microstrip Transmission Line Analysis Using the Characteristic Green's Function-Complex Images Technique
Finite Substrate Microstrip Transmission Line Analysis Using the Characteristic Green's Function-Complex Images Technique A. A. Shishegar, R. Faraji-Dana*, S. Safavi-Naeini** E&CE Dept., University of Tehran, PO Box: 14395-515, Tehran, Iran, shishgar@ut.ac.ir * E&CE Dept., University of Tehran, PO Box: 14395-515, Tehran, Iran, reza@ut.ac.ir ** E&CE Dept., University of Waterloo, Waterloo, On., N2L
Analysis of H-Plane Waveguide Components with Dielectric Obstacles by the BI-RME Method
Analysis of H-Plane Waveguide Components with Dielectric Obstacles by the BI-RME Method Paolo Arcioni1 , Vicente Boria2 , Maurizio Bozzi1 , Giuseppe Conciauro1 , and Benito Gimeno3 1 University of Pavia, Department of Electronics, Via Ferrata 1, I-27100 Pavia, Italy Phone: +39 0382505200, fax: +39 0382422583 e{mail: arcioni@ele.unipv.it, bozzi@ele.unipv.it, conciauro@ele.unipv.it 2 Univ. Polit¶