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EuMC: Tackling the Challenges of Over-The-Air Testing for New Space
Proceedings of the 53rd European Microwave Conference Tackling the Challenges of Over-The-Air Testing for New Space Benoit Derat Rohde & Schwarz GmbH & Co. KG, Germany Benoit.Derat@rohde-schwarz.com Abstract — New satellite constellations in LEO, MEO or GEO orbits and the integration of NTN in terrestrial communication networks will help to provide seamless connectivity. Key technologies for est
EuMC: Impact of Blockage on the Sensing Performance Using Distributed MIMO Architecture
Proceedings of the 53rd European Microwave Conference Impact of Blockage on the Sensing Performance Using Distributed MIMO Architecture Adham Sakhnini*#1 , Mamoun Guenach# , Andr´e Bourdoux# , Sofie Pollin*# * Department of Electrical Engineering (ESAT), KU Leuven, Belgium Microelectronics Centre (IMEC), Leuven, Belgium 1 adham.sakhnini@imec.be # Interuniversity Rx AP Abstract — This paper co
EuMC: TanDEM-X Mission Status
Proceedings of the 53rd European Microwave Conference TanDEM-X Mission Status Christo Grigorov1, Markus Bachmann1, Johannes Böer1, Thomas Kraus1, Marie Lachaise2, Manfred Zink1 1 Microwaves and Radar Institute, German Aerospace Center (DLR), Germany Remote Sensing Technology Institute, German Aerospace Center (DLR), Germany Christo.Grigorov@dlr.de 2 Abstract — In 2010 the first formation flyin
EuMC: Gapwaves Waveguide Technology Comes of Age
Proceedings of the 53rd European Microwave Conference Gapwaves Waveguide Technology Comes of Age Carlo Bencivenni, Abbas Vosoogh, Abolfazl Haddadi Gapwaves AB, Sweden {carlo.bencivenni, abbas.vosoogh, abolfazl.haddadi}@gapwaves.com Abstract — Gapwaveguide technology was first introduced in 2008 by late Prof. Per-Simon Kildal and collaborators. This work generated a large interest and research gl
EuMC: IR-UWB Reader for Credit Card-Sized NFC Chipless RFID Tag Using Asymmetrical Stepped Impedance Resonators
Proceedings of the 53rd European Microwave Conference IR-UWB Reader for Credit Card-Sized NFC Chipless RFID Tag using Asymmetrical Stepped Impedance Resonators Fuminori Sakai#, Kazuo Ohta#, Yoshimasa Amano#, Mitsuo Makimoto*, Koji Wada* # Sakura Tech Corporation, Japan The University of Electro-Communications, Japan {sakai, ohta, amano}@sakuratech.jp, m.makimoto@ieee.org, wada.koji@uec.ac.jp *
EuMC: Highly Efficient HEMT Rectifier with a Wide Dynamic Range Based on a Hybrid Coupler for Wireless Power Transfer
Proceedings of the 53rd European Microwave Conference Highly Efficient HEMT Rectifier with a Wide Dynamic Range Based on a Hybrid Coupler for Wireless Power Transfer Jinyao Zhang, Yi Huang, Jiafeng Zhou Dept. of Electrical Engineering and Electronics, University of Liverpool, UK {Jinyao.Zhang, Yi.Huang, Jiafeng.Zhou}@liverpool.ac.uk Abstract — In this work, a HEMT-based rectifier with a hybrid c
EuMC: Linearity of PIN Diode Switch in Both ON-State and OFF-State
Proceedings of the 53rd European Microwave Conference Linearity of PIN Diode Switch in Both ON-state and OFF-state Farhad Ghorbani#1, Jiafeng Zhou#2, Mattias Gustafsson*3, Yi Huang#4 # Department of Electrical Engineering and Electronics, University of Liverpool, UK * R&D Center Huawei Technologies Sweden AB, Sweden 1 2 { F.ghorbani, Jiafeng.Zhou, 4Yi.Huang}@liverpool.ac.uk, 3Mattias.Gustafsson@
EuMC: A Fast Physical Optics Framework for Optimizing Quasi Optical Millimeter Wave Measurement Setups
Proceedings of the 53rd European Microwave Conference A Fast Physical Optics Framework for Optimizing Quasi Optical Millimeter Wave Measurement Setups Tobias K¨orner, Jochen Altholz, Steffen Gerling , Jan Barowski, Christian Schulz, Ilona Rolfes Institute of Microwave Systems, Ruhr University Bochum, Germany t.koerner@rub.de not provide satisfying results in the near field region [9]. Therefore,
EuMC: Experimental Validation of Class F Waveform Engineering in Class C Biasing Condition
Proceedings of the 53rd European Microwave Conference Experimental Validation of Class F Waveform Engineering in Class C Biasing Condition Francesco Manni1 , Rocco Giofr`e1 , Franco Giannini1 , Valeria Vadal`a2 , Gianni Bosi3 , Antonio Raffo3 , Giorgio Vannini3 , Paolo Colantonio1 1 Department of Elecronic Engineering, University of Roma Tor Vergata, Italy 2 Department of Physics, University of
EuMC: RF Performances and De-Embedding Techniques of Passive Devices in 3D Homogeneous Integration at Sub-THz
Proceedings of the 53rd European Microwave Conference RF Performances and De-Embedding Techniques of Passive Devices in 3D Homogeneous Integration at Sub-THz A. Oliveira#, O. Valorge #, C. Dubarry #, Y. Roelens*, M. Zaknoune*, J. Lugo-Alvarez # # CEA-Leti, France IEMN–Institut d’Electronique de Microélectronique et de Nanotechnologie, France {alexandre.oliveira, jose.lugo}@cea.fr * interconnec