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EuMC: Planar N-Way Power Combiner with High Isolation Between Input Ports
Proceedings of the 51st European Microwave Conference Planar N-Way Power Combiner with High Isolation Between Input Ports Sayyed-Hossein Javid-Hosseini# , Pouria Toofanzadeh# , Vahid Nayyeri#1 # School of Advanced Technologies, Iran University of Science and Technology, Tehran, Iran 1 Nayyeri@iust.ac.ir, with waveguides and their medium. A PCB combiner on the other hand is much lighter, smaller
EuMC: D-Band FMCW Radar with Sub-cm Range Resolution Based on a BiCMOS mmWave IC
Proceedings of the 51st European Microwave Conference D-Band FMCW Radar with sub-cm Range Resolution based on a BiCMOS mmWave IC Wael A. Ahmad# , Maciej Kucharski& , Herman Jalli Ng+ , Dietmar Kissinger* # IHP - Leibniz-Institut f¨ur innovative Mikroelektronik, Germany and Imaging Research Center, Gdynia, Poland + Karlsruhe University of Applied Sciences, Germany * Institute of Electronic Device
EuMC: Microstrip Coupled-Line Directional Coupler for High-Sensitivity Dielectric Constant Measurement
Proceedings of the 51st European Microwave Conference Microstrip Coupled-Line Directional Coupler for High-Sensitivity Dielectric Constant Measurement Zahra Rahimian Omam*, Vahid Nayyeri#, Omar M. Ramahi+ * NANOTAM-Nanotechnology Research Center, Bilkent University, Turkey School of Advanced Technologies, Iran University of Science and Technology, Iran + Department of Electrical and Computer Eng
EuMC: A Heterodyne Transceiver with Integrated Calibrator for K/Ka-Band Phased Arrays
Proceedings of the 51st European Microwave Conference A Heterodyne Transceiver With Integrated Calibrator for K/Ka-Band Phased Arrays Anton Sieganschin, Nils C. Albrecht, Bartosz Tegowski, Thomas Jaschke, Jan Waldhelm, Nadja J. Lamann, Arne F. Jacob Institute of High-Frequency Technology, Hamburg University of Technology, Germany {Anton.Sieganschin, Nils.Albrecht, Bartosz.Tegowski, Jaschke, Jan.W
EuMC: Material Characterization Using Power Measurements: Miracle of Machine Learning
Proceedings of the 51st European Microwave Conference Material Characterization Using Power Measurements: Miracle of Machine Learning Tahoura Mosavirik#1 , Mohammad Hashemi* , Mohammad Soleimani# , Vahid Nayyeri$2 , and Omar M. Ramahi% # School of Electrical Engineering, Iran University of Science and Technology, Tehran, Iran of Electrical and Computer Engineering, University of Tehran, Tehran,
EuMC: ANN Model Development for Tunable Bandpass Filter
Proceedings of the 51st European Microwave Conference ANN Model Development for Tunable Bandpass Filter Chandan Roy#, Ping Zhao*, Ke Wu# # Poly-Grames Research Center, Polytechnique Montreal, Canada * Xidian University, China Chandan.roy@polymtl.ca, aoing56@gmail.com, ke.wu@polymtl.ca Abstract—This paper presents an algorithm to develop artificial neural network (ANN) models for predicting suita
EuMC: An Integrated Multiphysics Model for Phase-Change Material Switches
Proceedings of the 51st European Microwave Conference An Integrated Multiphysics Model for Phase-Change Material Switches Ines Bettoumi*#1, Kateryna Kiryukhina*2, Olivier Puig*3, Pierre Blondy#4 * CNES, France XLIM CNRS UMR 7252, Universite de Limoges, France {1ines.bettoumi, 4pierre.blondy}@xlim.fr, {2kateryna.kiryukhina, 3olivier.puig}@cnes.fr # The model implementation will be described in a
EuMC: Terahertz Non-Destructive Testing of the Mica Insulation of Power Generator Bars in FMCW Measurements with a Dielectric Waveguide Antenna
Proceedings of the 51st European Microwave Conference Terahertz Non-destructive Testing of the Mica Insulation of Power Generator Bars in FMCW Measurements with a Dielectric Waveguide Antenna Maris Bauer#1, Carsten Matheis#, Andrey Mashkin*, Stefan Krane*, Friedhelm Pohlmann*, Fabian Friederich#2 # Department of Materials Characterization and Testing, Fraunhofer ITWM, Kaiserslautern, DE-67663, G
EuMC: Modeling and Measurement of Double Stacked Microvia in Antenna-in-Package Module for 5G mmWave Applications
Proceedings of the 51st European Microwave Conference Modeling and Measurement of Double Stacked Microvia in Antenna-in-Package Module for 5G mmWave Applications Kavin Senthil Murugesan*, Stefan Kosmider#, Oliver Schwanitz#, Uwe Maaß#, Ivan Ndip#, Andreas Ostmann#, Klaus Dieter Lang*# * Technische Universität Berlin, Germany Fraunhofer Institute for Reliability and Microintegration, IZM, Germany
EuMC: A Novel Chip to PCB-Half-Embedded Waveguide Transition
Proceedings of the 51st European Microwave Conference A Novel Chip to PCB-Half-Embedded Waveguide Transition T. Lampersberger#, R. Feger#, M.J. Lang*, J. Minichshofer*, S.W. Sattler+, A. Stelzer# # Institute for Communications Engineering and RF Systems, Johannes Kepler University Linz, Austria * Infineon Technologies Linz, Austria + AT&S Austria Technologie & Systemtechnik, Austria thomas.lampe