Knowledge Centre
Find a document written by the best international scientists in our secure database.
24776 documents found.
Optically Controlled Switching in Microwave Bridges
Optically Controlled Switching in Microwave Bridges Xin Xue, Haiqing Wei, and I. Shih Department of Electrical and Computer Engineering McGill University, 3480 University Street Montreal, Quebec, Canada H3A 2A7 xxue@photonics.ece.mcgill.ca ABSTRACT A novel design for optically controlled microwave switching is presented, which is based on a microwave bridge structure consisting of a coplanar wave
Transmission Characteristics of all semiconductor fiber optic links carrying microwave channels
Transmission Characteristics of All Semiconductor Fiber Optic Links Carrying Microwave Channels Tamás Marozsák, Eszter Udvary, Tibor Berceli Technical University of Budapest, Department of Microwave Communications H-1111 Budapest, Goldmann György-tér 3, Hungary, Tel.: (36)-1-463-4142, Fax: (36)-1-463-3289 e-mail: marozsak@nov.mht.bme.hu Abstract - An experimental and theoretical study is present
Grating-based Optical Microwave FIR Filter
1 Grating-based Optical Microwave FIR Filter Ningsi You and Robert A. Minasian School of Electrical and Information Engineering & Australian Photonics CRC University of Sydney, NSW 2006, Australia ningsi@ee.usyd.edu.au r.minasian@ee.usyd.edu.au Abstract - A new grating-based wavelength multiplexed optical microwave filter is presented. This uses novel wavelength mapping and symmetry concepts to
Liquid crystal phase shifter for optically generated RF-Signals
Liquid Crystal Phase Shifter for Optically Generated RF-Signals Wolfgang Vogel, Manfred Berroth Institute for Electrical and Optical Communication Engineering, University of Stuttgart w.vogel@int.uni-stuttgart.de, berroth@int.uni-stuttgart.de Abstract - In this paper we present a phase shifter for optically generated RF-signals including a liquid crystal amplitude modulator. The light is intensi
Microwave photoinduced varactor on silicon substrate
MICROWAVE PHOTOINDUCED VARACTOR ON SILICON SUBSTRATE P. Ahouassa1, A. Vilcot1 , M. Bouthinon1 and J. Boussey2 1 LEMO, Laboratoire d'Electromagnétisme, Microondes et d'Optoélectronique, UMR CNRS/INPG 5530 Email: ahouassa@enserg.fr, vilcot@enserg.fr, mbouthin@enserg.fr, and boussey@enserg.fr 2 LPCS, Laboratoire de Physique des Composants à Semiconducteurs, UMR CNRS/INPG 5531 ENSERG- 23 rue des Mar
H-plane mode conversion and application in printed microwave integrated circuit
H-Plane Mode Conversion and Application in Printed Microwave Integrated Circuit Ching-Kuang C. Tzuang, Kuo-Cheng Chen, Cheng-Jung Lee, Chia-Cheng Ho and Hsien-Shun Wu Institute of Electrical Communication Engineering National Chiao Tung University Hsinchu, TAIWAN E-mail: cktzuang@cc.nctu.edu.tw Abstract - This paper presents a novel MIC (microwave integrated circuit) design plastic-injection-moldi
Millimeter-wave 3D integration techniques using LTCC and related mulrilayer circuits
MILLIMETER-WAVE 3D INTEGRATION TECHNIQUES USING LTCC AND RELATED MULTILAYER CIRCUITS Wolfgang Menzel, Jürgen Kassner* University of Ulm, Microwave Techniques, D-89069 Ulm, Germany * now with IMST, D-47475 Kamp-Lintfort, Germany Abstract - LTCC, HTCC, and similar sandwiched substrate structures provide the basis for highdensity 3D integration and packaging of microwave and mm-wave circuits. Such m
Interconnects for a multi-layer three-dimensional silicon architecture
Interconnects for a Multi-Layer Three-Dimensional Silicon Architecture Katherine J. Herrick1 , Robert T. Kihm2 , and Linda P. B. Katehi1 1 Radiation Laboratory, Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, Michigan, 49109-2122, USA. kherrick@engin.umich.edu, katehi@engin.umich.edu. 2 Raytheon Systems Company, El Segundo, California 90245, USA. rki
A multilayer integration techique for low-loss, low-crosstalk interconnects and circuits for RF silicon MMICs
A Multilayer Integration Technique for Low-loss, Low-crosstalk Interconnects and Circuits for RF Silicon MMICs Marc DeVincentis, Juno Kim, Yongxi Qian, Guojin Feng, Pingxi Ma, M. Frank Chang and Tatsuo Itoh Electrical Engineering Department University of California, Los Angeles Los Angeles, CA 90095-1594, USA Phone: (310) 206-1024, Fax: (310) 206-4819 Email: marcd@ee.ucla.edu Abstract This paper
Hybrid Integration and Interconnect Design Platforms of Planar Circuit and Non-Radiative Dielectric (NRD) Guide for Millimeter-Wave Integrated Circuits and Systems
Hybrid Integration and Interconnect Design Platforms of Planar Circuit and Non-Radiative Dielectric (NRD) Guide for MillimeterWave Integrated Circuits and Systems Ke WU Poly-Grames Research Center Department of Electrical and Computer Engineering C. P. 6079, Succ. Centre-Ville Ecole Polytechnique, Montreal, Quebec, Canada H3C 3A7 E-mail: wuke@grmes.polymtl.ca Abstract This paper presents a cla