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EuMC: Spectral Filtering Setup for Uncorrelated Multi-Tone Phase and Amplitude Measurement
Spectral Filtering Setup for Uncorrelated Multi-tone Phase and Amplitude Measurement João P. Martins and Nuno Borges Carvalho Instituto de Telecomunicações, Campo Universitário, 3810-193 Aveiro, Portugal joaoptm@av.it.pt; nborges@ieee.org Abstract -- This paper presents a setup for correlated and uncorrelated multi-tone phase and amplitude measurement. This method is based on a simple hardware imp
EuMC: A New Approach to Mixer's Linearization
A New Approach to Mixer's Linearization João P. Martins, Nuno Borges Carvalho and José Carlos Pedro Instituto de Telecomunicações, Campo Universitário, 3810-193 Aveiro, Portugal joaoptm@av.it.pt; nborges@ieee.org; jcpedro@ieee.org Abstract -- This paper presents a new approach to mixer linearization using the post-distortion technique. A practical prototype was designed implemented and characteri
EuMC: High-Selective Microwave Active Bandpass Filter Using Transmission Line Interference Sections
Highselective microwave active bandpass filter using transmission line interference sections Roberto G´ mezGarc´a, Jos´ I. Alonso o i e ´ Dpto. Se~ ales, Sistemas y Radiocomunicaciones. ETSI Telecomunicacion. n Universidad Polit´ cnica de Madrid. Ciudad Universitaria s/n, 28040 Madrid, Spain. e Tel: 34913367358, email: roberto@gmr.ssr.upm.es , ignacio@gmr.ssr.upm.es passband. Furthermore, th
EuMC: Improved Numerical TRL Calibration Technique in a Deterministic MoM Algorithm
IMPROVED NUMERICAL TRL CALIBRATION TECHNIQUE IN A DETERMINISTIC MOM ALGORITHM Lin Li1), Ke Wu1), Peter Russer2) 1) Poly-Grames Research Center, Department of Electrical Engineering Ecole Polytechnique de Montreal, Quebec, Canada H3C 3A7 E-mail: wuke@grmes.polymtl.ca 2) Hochfrequenztechnik, Technische Universitaet Muenchen Arcisstrasse 21, D-80333 Munich, Germany application concept. In this work,
EuMC: Bandwidth Improvement of Ceramic Feedthrough in Hermetic Packaging
Bandwidth Improvement of Ceramic Feedthrough in Hermetic Packaging Christophe A. Tavernier1*, Victor Rodrigues2, Frederic Hosatte1*, Wladimir Muffato 1**, Cecile Charvin1**, Philippe Maeder1**, Roberto Vigo3 1 EGIDE, egide@egide.fr, *Trappes, 78190,**Bollene, 84500, France, 2AVANEX France, Victor_Rodrigues@avanex.com, Route de Villejust, 91625, Nozay Cedex, France, 3EGIDE USA, rvigo@egideusa.com,
EuMC: Precise Simulation of LDMOS Temperature Effects Using Tricubic Spline Functions
Precise simulation of LDMOS temperature effects using tricubic spline functions R. Follmann, D. K¨ ther, R. Stahlmann and I. Wolff1 o J. Gajadharsing, M. Versleijen and J. Sveshtarov2 2 IMST GmbH, D47475 Kamp-Lintfort, Germany, email: follmann@imst.de Semiconductors, Nijmegen, Netherlands, e-mail John.Gajadharsing@philips.com Measured and simulated ID 1 ID [mA] Abstract-- Power transistor dev
EuMC: Wideband and Efficient Interconnects Using Multi-Segmented Grounded and Opened Lines
Wideband and Efficient Interconnects using Multi-Segmented Grounded and Opened Lines Mohammad Khalaj Amirhosseini, Ahmad Cheldavi Iran University of Science and Technology - College of Electrical Engineering - Narmak Tehran I.R.Iran Abstract -- Two new interconnect structures called multisegmented S-G-S (Signal-Ground-Signal) and S-O-S (Signal-Open-Signal) interconnects are introduced and desi
ECWT: Microwave Applications of Advanced Semiconductor Technologies
Microwave applications of advanced semiconductor technologies R.P. Mertens*, W. De Raedt, G. Carchon, H.A.C. Tilmans and M. Germain IMEC, MCP-division, Kapeldreef 75, 3001 Leuven, Belgium *also ESAT, KULeuven Abstract New semiconductor technologies, used in passive microwave applications, allow the integration of passives with high quality factors and the fabrication of novel RFMEMS components f
ECWT: Bottom-Up Nanoelectronics
Bottom-up Nanoelectronics Peter Hadley Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands Abstract -- Nanoelectronics is a broad topic that spans molecular devices to silicon field-effect transistors. While the development of nanoscale silicon devices is an important topic, the focus here will be on the challengers to silicon such as molecules, carbon nanotubes
ECWT: Communication Technologies-Present and Future
Communication Technologies-Present and future (Plenary Talk) Vijay Nair and Uttam Sengupta Platform Research Lab, Corporate Technology Group Intel Corporation Hillsboro, Oregon, 97124 USA Abstract -- Future communication devices will have to operate over heterogeneous wireless networks and standards around the world. The dream of a ubiquitous device that provides unhindered connectivity any where