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EuMC: Analysis of Loss Mechanisms in Coplanar Waveguides Integrated on Bulk CMOS Substrates
Proceedings of the 39th European Microwave Conference Analysis of loss mechanisms in coplanar waveguides integrated on bulk CMOS substrates Federico Vecchi#X,1, Matteo Repossi*,2, Wissam Eyssa#X,3, Paolo Arcioni#,4, Francesco Svelto#,5 # 1 { federico.vecchi, 3wissam.eyssa, 4paolo.arcioni, 5francesco.svelto}@unipv.it X Dipartimento di Elettronica, Università di Pavia Via Ferrata 1, Pavia, Italy
EuMC: Defected and Floating Ground Structures for Vertical Interconnects
Proceedings of the 39th European Microwave Conference Defected and Floating Ground Structures for Vertical Interconnects A. Stark, H. Olbert, A. F. Jacob Institut für Hochfrequenztechnik, Technische Universität Hamburg-Harburg 21073 Hamburg, Germany alexander.stark@tuhh.de Abstract-- Defected and floating ground structures for vertical interconnects are investigated up to the E-band. For quasi s
EuMC: A 0.7-V 60-GHz Low-Power LNA with Forward Body Bias Technique in 90nm CMOS Process
Proceedings of the 39th European Microwave Conference A 0.7-V 60-GHz Low-Power LNA with Forward Body Bias Technique in 90 nm CMOS Process Wei-Heng Lin#1, Jeng-Han Tsai*2, Yung-Nien Jen, #3 Tian-Wei Huang#4, and Huei Wang#5 # Dept. of Electrical Engineering and Graduate Institute of Communication Engineering National Taiwan University, Taipei, Taiwan, 106, R.O.C. linweiheng@gmail.com b91701204@nt
EuMC: Semi-Analytical Formulation for the Phase-Noise Analysis of Injection-Locked Push-Push Oscillators
Proceedings of the 39th European Microwave Conference Semi-Analytical Formulation for the Phase-Noise Analysis of Injection-Locked Push-Push Oscillators Elena Fernández, Mabel Pontón, Franco Ramírez, Sergio Sancho, Almudena Suárez DICOM, Universidad de Cantabria 39005 Santander, Spain ramirezf@unican.es Abstract-- This paper presents a semi-analytical formulation for the phase-noise analysis of i
EuMC: HMIC Wafer Level Packaging
Proceedings of the 39th European Microwave Conference HMIC Wafer Level Packaging Timothy Boles, David Hoag, Margaret Barter, Richard Giacchino, Paul Hogan, Joel Goodrich* M/A-COM Technology Solutions, Lowell, Massachusetts, 01851, USA Timothy.Boles@macomtech.com David.Hoag@macomtech.com Margaret.Barter@macomtech.com Paul.Hogan@macomtech.com Richard.Giacchino@macomtech.com *Formerly with M/A-COM
EuMC: Estimation of Magnetic Field Coverage Inside the Car for Passive Access System Entry
Proceedings of the 39th European Microwave Conference Estimation of Magnetic Field Coverage inside the Car for Passive Access System Entry A. Takacs#&1, M. Huard*2, S. Kessler+3, G. A. Chakam¤4, E. Lardjane*5 # LAAS-CNRS Université de Toulouse, 7, avenue du Colonel Roche, F-31077 Toulouse, France 1 atakacs@laas.fr 1 & Military Technical Academy, 81-83 George Cosbuc Bvd., Bucharest, Romania ta
EuMC: Unified Time- and Frequency-Domain Approach for Accurate Modelling of Electromagnetic Radiation Processes in Ultra-Wideband Antennas
Proceedings of the 39th European Microwave Conference Unified Time- and Frequency-Domain Approach for Accurate Modelling of Electromagnetic Radiation Processes in Ultra-Wideband Antennas Diego Caratelli, Alexander Yarovoy, and Leo P. Ligthart International Research Centre for Telecommunications and Radar, Delft University of Technology, the Netherlands d.caratelli@tudelft.nl Abstract-- In this pa
EuMC: X-Band Phase-Shifting Dual-Output Balanced Amplifier MMIC
Proceedings of the 39th European Microwave Conference X-band Phase-Shifting Dual-Output Balanced Amplifier MMIC G. van der Bent, T.S. de Boer, R. van Dijk, M.W. van der Graaf, A. P. de Hek, F.E. van Vliet. TNO Defence, Security and Safety, Oude Waalsdorperweg 63, 2509 JG, The Hague, The Netherlands gijs.vanderbent@tno.nl bjorn.deboer@tno.nl raymond.vandijk@tno.nl marcel.vandergraaf@tno.nl peter.d
EuMC: Packaging of Photodetector Modules for 100Gbit/s Applications Using Electromagnetic Simulations
Proceedings of the 39th European Microwave Conference Packaging of Photodetector Modules for 100 Gbit/s Applications Using Electromagnetic Simulations C. Jiang#1, V. Krozer#, H-G. Bach*, G. G. Mekonnen*, and T. K. Johansen# # Department of Electrical Engineering, Technical University of Denmark, Kgs. Lyngby, 2800, Denmark 1 cj@elektro.dtu.dk * Fraunhofer Institute for Telecommunications, Hein
EuMC: Broadband Class-F Power Amplifiers for Handset Applications
Proceedings of the 39th European Microwave Conference Broadband Class-F Power Amplifiers for Handset Applications Daehyun Kang 1 , Jinsung Choi 1 , Myoungsu Jun 1 , Dongsu Kim 1 , Jungmin Park 1 , Boshi Jin 1 , Daekyu Yu 2 , Kyoungjoon Min 2 , Bumman Kim 1 1 Department of Electrical Engineering, Pohang University of Science and Technology, San 31, Hyoja-dong, Nam-gu, Pohang, Gyeongbuk, 790-784,